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Evidence for the surface diffusion mechanism of thermal grooving in copper

✍ Scribed by N.A. Gjostein; F.N. Rhines

Publisher: Elsevier Science
Year: 1959
Weight: 705 KB
Volume: 7
Category: Article
ISSN: 0001-6160
DOI: 10.1016/0001-6160(59)90083-5

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