Evaluation of LPCVD MeSiN (MeTa, Ti, W, Re) diffusion barriers for Cu metallizations

✍ Scribed by E. Blanquet; A.M. Dutron; V. Ghetta; C. Bernard; R. Madar

• Book ID: 114155671
• Publisher: Elsevier Science
• Year: 1997
• Tongue: English
• Weight: 430 KB
• Volume: 37-38
• Category: Article
• ISSN: 0167-9317
• DOI: 10.1016/s0167-9317(97)00111-1