Etch characteristics of KOH, TMAH and dual doped TMAH for bulk micromachining of silicon

✍ Scribed by K. Biswas; S. Kal

• Publisher: Elsevier Science
• Year: 2006
• Tongue: English
• Weight: 347 KB
• Volume: 37
• Category: Article
• ISSN: 0026-2692
• DOI: 10.1016/j.mejo.2005.07.012