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Epoxyless Fiber-to-Submount Bonding for Active Fiber Optoelectronic and Fiber Backplane Applications

✍ Scribed by Abeysinghe, D.C.; Ranatunga, V.; Banerjee, A.; Balagopal, A.; Klotzkin, D.J.

Book ID: 114570238
Publisher: IEEE
Year: 2006
Tongue: English
Weight: 534 KB
Volume: 12
Category: Article
ISSN: 1077-260X
DOI: 10.1109/jstqe.2006.881876

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