✦ LIBER ✦
A novel technique for high-strength direct fiber-to-Si submount attachment using field-assisted anodic bonding for optoelectronics packaging
✍ Scribed by D.C. Abeysinghe; V. Ranatunga; A. Balagopal; Haichuan Mu; Kuntao Ye; D. Klotzkin
- Book ID
- 119801397
- Publisher
- IEEE
- Year
- 2004
- Tongue
- English
- Weight
- 257 KB
- Volume
- 16
- Category
- Article
- ISSN
- 1041-1135
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