Epoxy resins based on resorcinol and its derivatives
✍ Scribed by V. P. Sorokin; V. A. Bobylev; A. D. Eselev
- Book ID
- 111470426
- Publisher
- SP MAIK Nauka/Interperiodica
- Year
- 2007
- Tongue
- English
- Weight
- 148 KB
- Volume
- 49
- Category
- Article
- ISSN
- 1811-2382
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## Abstract The phthalide‐containing epoxy resins are synthesized and characterized in comparison with the bisphenol‐A epoxy resins in terms of thermal properties. Although both resins contain comparable amounts of halogens, the resulting flame retardancy is higher in the phthalide‐containing resin
Low molecular weight epoxy resin based on bis (4hydroxy phenyl) 1,1 cyclohexane was prepared and modified with various types of the prepared phenolic resins. Phenol±, cresol±, resorcinol±and salicylic acid± formaldehyde resins were used. The optimum conditions of formulation and curing process were