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Enhanced moisture protection of electronic devices by ultra-thin polyimide films

โœ Scribed by Burack, J.J.; LeGrange, J.D.; Lin, A.W.

Book ID
117872705
Publisher
IEEE
Year
1990
Tongue
English
Weight
463 KB
Volume
13
Category
Article
ISSN
0148-6411

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Photosensitive polyimide was selected as a protection layer for the YBa 2 Cu 3 O 7ร€x circuits and stability of ramp-edge-junction characteristics against atmospheric moisture was investigated. Both coating and patterning of the protection layer could simultaneously be formed on the ramp-edge-junctio