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Surface protection of oxide circuit by polyimide thin film

✍ Scribed by Y. Oshikubo; Y. Tarutani; H. Wakana; S. Adachi; Y. Ishimaru; K. Nakayama; T. Hato; O. Horibe; K. Tanabe

Publisher
Elsevier Science
Year
2006
Tongue
English
Weight
215 KB
Volume
445-448
Category
Article
ISSN
0921-4534

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✦ Synopsis

Photosensitive polyimide was selected as a protection layer for the YBa 2 Cu 3 O 7Γ€x circuits and stability of ramp-edge-junction characteristics against atmospheric moisture was investigated. Both coating and patterning of the protection layer could simultaneously be formed on the ramp-edge-junctions by using the polyimide film. Characteristic change of the ramp-edge-junctions that were coated with a polyimide film were less than 10% after thermal cycling more than ten times between room temperature and liquid He temperature. On the other hand, characteristic change was much more than 20% for the bare junction as narrow as 2 lm.

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