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Enhanced adhesion of Cu-W thin films by ion beam assisting bombardment implanting

✍ Scribed by Ling-ping ZHOU; Ming-pu WANG; Rui WANG; Zhou LI; Jia-jun ZHU; Kun PENG; De-yi LI; Shao-lu LI

Book ID: 117693530
Publisher: Elsevier Science
Year: 2008
Tongue: English
Weight: 955 KB
Volume: 18
Category: Article
ISSN: 1003-6326
DOI: 10.1016/s1003-6326(08)60065-5

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