Engineering Design Handbook - Dielectric Embedding of Electrical or Electronic Components: (DARCOM-P 706-315)

Publisher: U.S. Army Materiel Command
Tongue: English
Leaves: 174
Category: Library

No coin nor oath required. For personal study only.

✦ Synopsis

This 1979 Handbook is concerned with the use of epoxies, polyurethanes, and silicones as insulating embedding agents for electrical and electronic components. These three families of resins are the materials which currently find the widest use in high performance component protection. Another material, the polyxylylenes, which are vacuum deposited on substrates as very think dielectrics, is also discussed. The processes of embedding which are discussed include encapsulation, potting, casting, conformal coating, surface coating, impregnation, and transfer molding. It is the purpose of this Handbook to acquaint Army personnel with the most important characteristics of the mentioned types of embedding agents and the typical processes of applying these insulating polymers to the circuit components.

✦ Table of Contents

Content:
• Front Matter
• List of Illustrations
• List of Tables
• Preface
• Table of Contents
1. Introduction
2. General Information on Embedding Resins, and Procedures for Use
3. Epoxy Embedding Resins
4. Polyurethane Embedding Agents
5. Silicone Embedding Agents
6. Vapor-Deposited Poly-p-Xylylene Dielectrics
7. Use of Fillers
8. Embedments and Electrical Properties
9. Factors of Resin Purity and Component Cleaning
10. Protection against Moisture, Corrosion, and Biological Degradation
11. Coatings for Circuit Boards and Similar Substrates
12. Stress; Resin Type Choice; Correction of Defective Embedments
• 13. Epilogue - Appendixes; Changes in the Technology; Up-to-Date Advice on Embedding
Appendices
Index

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