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Electronic transport in RuO2-based thick film resistors at low temperatures

✍ Scribed by J. Roman; V. Pavlík; K. Flachbart; C. J. Adkins; J. Leib

Publisher
Springer US
Year
1997
Tongue
English
Weight
487 KB
Volume
108
Category
Article
ISSN
0022-2291

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✍ Niko Sebastian Dorsch; Ilya Peshekhodov; Philipp Spies; Gerold A. Schneider 📂 Article 📅 2008 🏛 Elsevier Science 🌐 English ⚖ 663 KB

Parameters for the fracture mechanics of thick film materials are scarce in the literature. One reason is that for many such materials it is very difficult to produce a bulk specimen as required for most standard tests. This paper describes an alternative method for measuring the fracture resistance