๐”– Bobbio Scriptorium
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Electronic systems packaging: future reliability challenges

โœ Scribed by J. Baffett


Book ID
108362380
Publisher
Elsevier Science
Year
1998
Tongue
English
Weight
919 KB
Volume
38
Category
Article
ISSN
0026-2714

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Reliability challenges in 3D IC packagin
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At the moment, a major paradigm change, from 2D IC to 3D IC, is occurring in microelectronic industry. Joule heating is serious in 3D IC, and vertical interconnect is the critical element to be developed. Also reliability concerns will be extremely important. For example, in order to remove heat, a