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Metallurgical challenges in microelectronic 3D IC packaging technology for future consumer electronic products

✍ Scribed by K. N. Tu, Tian Tian

Book ID: 120799456
Publisher: SP Science China Press
Year: 2013
Tongue: English
Weight: 774 KB
Volume: 56
Category: Article
ISSN: 1006-9321
DOI: 10.1007/s11431-013-5261-y

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