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Electronic structure mechanism for the wettability of Sn-based solder alloys

✍ Scribed by Wufeng Feng; Chunqing Wang; M. Morinaga

Book ID
107452852
Publisher
Springer US
Year
2002
Tongue
English
Weight
171 KB
Volume
31
Category
Article
ISSN
0361-5235

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## Abstract Corrosion properties of three different Sn‐Ag lead free solder alloys have been investigated in 0.3 wt% Na~2~SO~4~ solution as corrosive environment. As cast solder alloy was analyzed by X‐ray diffraction (XRD) and scanning electron microscopy (SEM). Volume fractions of the Ag~3~Sn in t