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Electronic speckle pattern interferometry analysis of tensile tests of semihard copper sheets

✍ Scribed by C. Vial-Edwards; I. Lira; A. Martinez; M. Münzenmayer

Book ID
105535074
Publisher
Sage Publications
Year
2001
Tongue
English
Weight
654 KB
Volume
41
Category
Article
ISSN
0014-4851

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