𝔖 Bobbio Scriptorium

✦ LIBER ✦

Electronic packaging in the 1990s—a perspective from Asia : Takaaki Ohsaki. IEEE Trans. Compon. Hybrids mfg Technol.14(2), 254 (1991)

Book ID: 103287769
Publisher: Elsevier Science
Year: 1992
Tongue: English
Weight: 134 KB
Volume: 32
Category: Article
ISSN: 0026-2714
DOI: 10.1016/0026-2714(92)90577-8

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Electronic packaging in the 1990s—a pers

Electronic packaging in the 1990s—a perspective from America : Rao R. Tummala. IEEE Trans. Compon. Hybrids Mfg Technol.14(2), 262 (1991)

📂 Article 📅 1992 🏛 Elsevier Science 🌐 English ⚖ 130 KB

Electronic packaging in the 1990s: the p

Electronic packaging in the 1990s: the perspective from Europe : Hermann Wessely, Otmar Fritz, Michael Horn, Peter Flimke, Walter Koschnick and Karl-Heinz Schmidt. IEEE Trans. Compon. Hybrids mfg Technol.14(2), 272 (1991)

📂 Article 📅 1992 🏛 Elsevier Science 🌐 English ⚖ 134 KB

Representation of thermal behaviour of e

Representation of thermal behaviour of electronic components for the creation of a databank : Jean Pierre Le Jannou and Yves Huon. IEEE Trans. Compon. Hybrids mfg Technol.14(2), 366 (1991)

📂 Article 📅 1992 🏛 Elsevier Science 🌐 English ⚖ 100 KB

A comparison of metal-in-elastomer conne

A comparison of metal-in-elastomer connectors: the influence of structure on mechanical and electrical performance : Gabriela Rosen, Patrick T. Robinson, Viorica Florescu and Michael T. Singer. IEEE Trans. Compon. Hybrids mfg Technol.14(2), 342 (1991)

📂 Article 📅 1992 🏛 Elsevier Science 🌐 English ⚖ 100 KB