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Electronic packaging in the 1990s—a perspective from America : Rao R. Tummala. IEEE Trans. Compon. Hybrids Mfg Technol.14(2), 262 (1991)

Book ID: 103287776
Publisher: Elsevier Science
Year: 1992
Tongue: English
Weight: 130 KB
Volume: 32
Category: Article
ISSN: 0026-2714
DOI: 10.1016/0026-2714(92)90584-8

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