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Electromigration-induced compressive stress in encapsulated thin-film conductors : R. S. Hemmert and M. Costa. IEEE/IRPS, 64 (1991)

Book ID: 103287795
Publisher: Elsevier Science
Year: 1992
Tongue: English
Weight: 125 KB
Volume: 32
Category: Article
ISSN: 0026-2714
DOI: 10.1016/0026-2714(92)90603-i

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