✦ LIBER ✦

Electromigration in thin aluminum films on titanium nitride

✍ Scribed by Blech, I. A.

Book ID: 118057367
Publisher: American Institute of Physics
Year: 1976
Tongue: English
Weight: 680 KB
Volume: 47
Category: Article
ISSN: 0021-8979
DOI: 10.1063/1.322842

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Deposition and characterization of non-c

Deposition and characterization of non-conducting silicon nitride, aluminum nitride and titanium-aluminum nitride thin films

✍ I.J.R. Baumvol; F.C. Stedile; W.H. Schreiner; F.L. Freire Jr.; A. Schröer 📂 Article 📅 1993 🏛 Elsevier Science 🌐 English ⚖ 596 KB

Interfacial Reaction between Titanium Th

Interfacial Reaction between Titanium Thin Films and Aluminum Nitride Substrates

✍ Yoshihiko Imanaka; Michael R. Notis 📂 Article 📅 2004 🏛 John Wiley and Sons 🌐 English ⚖ 222 KB

Nanograined Titanium Nitride Thin Films

✍ Igor Konyashin; German Fox-Rabinovich 📂 Article 📅 1998 🏛 John Wiley and Sons 🌐 English ⚖ 286 KB

Study on nitrided titanium alloy thin fi

Study on nitrided titanium alloy thin films

✍ Wu Beixin; Yang Guanyao; Wang Ren; Zhan Yunchang; Fu Baowei; Zhang Rongming; Zha 📂 Article 📅 1991 🏛 Elsevier Science 🌐 English ⚖ 118 KB

Stress gradients in titanium nitride thi

Stress gradients in titanium nitride thin films

✍ R. Machunze; G.C.A.M. Janssen 📂 Article 📅 2008 🏛 Elsevier Science 🌐 English ⚖ 367 KB

Titanium nitride films, as used for hard coatings, were deposited on silicon wafers by reactive unbalanced magnetron sputtering. For thinner films we find a higher compressive average residual stress than for thicker films. In the paper it is shown that this reduction in average stress is not due to

Aluminum Nitride Thin Films on an LTCC S

Aluminum Nitride Thin Films on an LTCC Substrate

✍ Jung W. Lee; Jerome J. Cuomo; Yong S. Cho; Roupen L. Keusseyan 📂 Article 📅 2005 🏛 John Wiley and Sons 🌐 English ⚖ 545 KB