Electroless nickel/gold bump in the flip-chip-type CMOS package for mobile-phone camera modules

✍ Scribed by Joong-Do Kim

• Book ID: 110627012
• Publisher: Springer US
• Year: 2006
• Tongue: English
• Weight: 272 KB
• Volume: 35
• Category: Article
• ISSN: 0361-5235
• DOI: 10.1007/bf02692446