✦ LIBER ✦
Electroless Ni/Au Bump on a Copper Patterned Wafer for the CMOS Image Sensor Package in Mobile Phones
✍ Scribed by Joong-Do Kim
- Book ID
- 107453892
- Publisher
- Springer US
- Year
- 2007
- Tongue
- English
- Weight
- 485 KB
- Volume
- 36
- Category
- Article
- ISSN
- 0361-5235
No coin nor oath required. For personal study only.