Nondestructive detection of delamination
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Y. C. Chan; X. Dai; G. C. Jin; N. K. Bao; P. S. Chung
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Article
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1997
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John Wiley and Sons
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English
β 364 KB
The use of an impro¨ed digital speckle correlation method ( ) DSCM was demonstrated for the in situ and nondestructi¨e detection of delaminations in layered-structure microcomponents such as multi-( ) layer ceramic capacitors MLCs in surface-mount printed circuit board assemblies. The delaminations