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Electrochemical corrosion of Sn–0.75Cu solder joints in NaCl solution

✍ Scribed by Yan-fang GAO; Cong-qian CHENG; Jie ZHAO; Li-hua WANG; Xiao-gang LI

Book ID
117694808
Publisher
Elsevier Science
Year
2012
Tongue
English
Weight
954 KB
Volume
22
Category
Article
ISSN
1003-6326

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Electrochemical corrosion study of Sn–3Ag–3Cu solder alloy in NaCl solution
✍ F. Rosalbino; E. Angelini; G. Zanicchi; R. Carlini; R. Marazza 📂 Article 📅 2009 🏛 Elsevier Science 🌐 English ⚖ 912 KB

## a b s t r a c t The corrosion behaviour of Sn-3Ag-3Cu (at%) alloy was investigated in 0.1 M NaCl solution by potentiodynamic polarization and impedance spectroscopy measurements and compared with that of the Sn-3Ag-0.5Cu (at%) solder employed in the packaging of some microelectronic components