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Electrical properties and interfacial reaction of BGA package with underfill

✍ Scribed by Bo-In Noh; Seung-Boo Jung

Book ID: 106397755
Publisher: Springer US
Year: 2007
Tongue: English
Weight: 289 KB
Volume: 19
Category: Article
ISSN: 0957-4522
DOI: 10.1007/s10854-007-9282-9

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