✦ LIBER ✦

Electrical modeling and simulation challenges in chip-package codesign

✍ Scribed by Cangellaris, A.C.

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

A Broadband Chip-Level Power-Bus Model F

✍ Hao-Hsiang Chuang; Chih-Jung Hsu; Hong, J.; Chun-Huang Yu; Cheng, A.; Ku, J.; Tz 📂 Article 📅 2010 🏛 IEEE 🌐 English ⚖ 530 KB

Modeling and Simulation of Spiral Induct

✍ Xinzhong Duo; Li-Rong Zheng; Hannu Tenhunen 📂 Article 📅 2003 🏛 Springer 🌐 English ⚖ 192 KB

Optimization for thermal and electrical

✍ Calmidi, V.V.; Mahajan, R.L. 📂 Article 📅 1998 🏛 IEEE ⚖ 130 KB

A Matlab-based modeling and simulation p

✍ Butler, K.L.; Ehsani, M.; Kamath, P. 📂 Article 📅 1999 🏛 IEEE 🌐 English ⚖ 219 KB

Challenges using modeling and simulation

✍ Michael W. Schreiner; Joseph R. Wirthlin 📂 Article 📅 2012 🏛 Elsevier 🌐 English ⚖ 360 KB

Electromagnetic Modeling and Simulation:

✍ Sevgi, Levent 📂 Article 📅 2014 🏛 IEEE 🌐 English ⚖ 726 KB