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Electrical characterization of isotropic conductive adhesive under mechanical loading

✍ Scribed by Zhimin Mo; Xitao Wang; Tiebing Wang; Shiming Li; Zonghe Lai; Johan Liu


Book ID
107452836
Publisher
Springer US
Year
2002
Tongue
English
Weight
417 KB
Volume
31
Category
Article
ISSN
0361-5235

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For the highly reliable interconnection in a micro-packaging technology requiring an excellent electrical and mechanical performance, the new anisotropic conductive adhesive (ACA) system with a low melting point solder was designed and characterized. An optimum flip-chip bonding cycle considering th