✦ LIBER ✦
Electrical Resistance and Microstructural Changes of Silver–Epoxy Isotropic Conductive Adhesive Joints Under High Humidity and Heat
✍ Scribed by Sun-Sik Kim; Keun-Soo Kim; KiJu Lee; Seongjun Kim; Katsuaki Suganuma; Hirokazu Tanaka
- Book ID
- 107457082
- Publisher
- Springer US
- Year
- 2010
- Tongue
- English
- Weight
- 618 KB
- Volume
- 40
- Category
- Article
- ISSN
- 0361-5235
No coin nor oath required. For personal study only.