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Effects of Trace Elements in Copper Fillers on the Electrical Properties of Conductive Adhesives

✍ Scribed by Li-Ngee Ho; Hiroshi Nishikawa; Naohide Natsume; Tadashi Takemoto; Koichi Miyake; Masakazu Fujita; Koyu Ota

Book ID: 107455645
Publisher: Springer US
Year: 2009
Tongue: English
Weight: 623 KB
Volume: 39
Category: Article
ISSN: 0361-5235
DOI: 10.1007/s11664-009-0946-5

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