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Study on the bimodal filler influence on the effective thermal conductivity of thermal conductive adhesive

✍ Scribed by Yan Zhang; Jing-yu Fan; Cong Yue; Johan Liu; Masahiro Inoue


Book ID
106186003
Publisher
Springer-Verlag
Year
2010
Tongue
English
Weight
585 KB
Volume
17
Category
Article
ISSN
0946-7076

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