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Effects of Thickness on the Residual Stress Behavior of High Temperature Polyimide Films

โœ Scribed by Chung, Hyunsoo; Joe, Yung-Il; Han, Haksoo

Book ID
121786406
Publisher
Nature Publishing Group
Year
2000
Tongue
English
Weight
567 KB
Volume
32
Category
Article
ISSN
0032-3896

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The effect of curing history on the resi
The effect of curing history on the residual stress behavior of polyimide thin films
โœ Hyunsoo Chung; Yungil Joe; Haksoo Han ๐Ÿ“‚ Article ๐Ÿ“… 1999 ๐Ÿ› John Wiley and Sons ๐ŸŒ English โš– 319 KB ๐Ÿ‘ 2 views

The effect of curing history on the residual stress behaviors in semiflexible structure poly(4,4ะˆ-oxydiphenylene pyromellitimide) (PMDA-ODA) and rigid structure poly(p-phenylene biphenyltetracarboximide) (BPDA-PDA) polyimide was investigated. Depending upon the curing history and different structure