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Effects of thermoplastic resin content of anisotropic conductive films on the pressure cooker test reliability of anisotropic conductive film flip-chip assembly

✍ Scribed by J. W. Hwang; M. J. Yim; K. W. Paik


Book ID
107453464
Publisher
Springer US
Year
2005
Tongue
English
Weight
530 KB
Volume
34
Category
Article
ISSN
0361-5235

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