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Effects of strain ratio and tensile hold time on low-cycle fatigue of lead-free Sn-3.5Ag-0.5Cu solder

✍ Scribed by Chin-Kuang Lin; Chun-Ming Huang

Book ID: 110627015
Publisher: Springer US
Year: 2006
Tongue: English
Weight: 538 KB
Volume: 35
Category: Article
ISSN: 0361-5235
DOI: 10.1007/bf02692449

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