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Effects of solder dimension on the interfacial shear strength and fracture behaviors of Cu/Sn–3Cu/Cu joints

✍ Scribed by Yang, L.M.; Zhang, Q.K.; Zhang, Z.F.


Book ID
119366599
Publisher
Elsevier Science
Year
2012
Tongue
English
Weight
664 KB
Volume
67
Category
Article
ISSN
1359-6462

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