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Effects of NH3, O2, and N2 co-implantation on Cu out-diffusion and antimicrobial properties of copper plasma-implanted polyethylene

✍ Scribed by Wei Zhang; Junhui Ji; Yihe Zhang; Qing Yan; E.Z. Kurmaev; A. Moewes; Jun Zhao; Paul K. Chu

Book ID
108060284
Publisher
Elsevier Science
Year
2007
Tongue
English
Weight
739 KB
Volume
253
Category
Article
ISSN
0169-4332

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