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Effects of mechanical stress and moisture on packaging interfaces

โœ Scribed by S. L. Buchwalter; P. J. Brofman; C. Feger; M. A. Gaynes; K. Lee; L. J. Matienzo; D. L. Questad

Book ID
126623523
Publisher
IBM
Year
2005
Tongue
English
Weight
498 KB
Volume
49
Category
Article
ISSN
0018-8646

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## Abstract The behavior of cured FM300 epoxy, a structural film adhesive, subjected to partial and full moisture saturation has been evaluated. Three separate but interrelated test methods were used: stress relaxation, fracture toughness, and dynamic mechanical testing. The mechanical response of