The curing behaviour and the development of physical properties of three commercial, silica filled epoxy/ anhydride resins that are used in solder 'flip-chip' technology were investigated by differential scanning calorimetry, dynamic mechanical analysis (d.m.a.) and Fourier transform infra-red (FTi.
✦ LIBER ✦
Effects of humidity on an epoxy adhesive
✍ Scribed by B. de Nève; M.E.R. Shanahan
- Book ID
- 103550551
- Publisher
- Elsevier Science
- Year
- 1992
- Tongue
- English
- Weight
- 688 KB
- Volume
- 12
- Category
- Article
- ISSN
- 0143-7496
No coin nor oath required. For personal study only.
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