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Effects of bonding frequency on Au wedge wire bondability

โœ Scribed by Yu Hin Chan; Jang-Kyo Kim; Deming Liu; Peter C. K. Liu; Yiu Ming Cheung; Ming Wai Ng

Book ID
106397784
Publisher
Springer US
Year
2007
Tongue
English
Weight
403 KB
Volume
19
Category
Article
ISSN
0957-4522

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โœ Yong Ding; Jang-Kyo Kim; Pin Tong ๐Ÿ“‚ Article ๐Ÿ“… 2006 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 604 KB

A numerical study is made of the elasto-plastic deformation taking place in ultrasonic wire bonding based on the finite element method. A special focus has been placed on how the important wire bonding parameters, such as bond force and power, affect the contact pressure along the wire-bond pad inte