Effect of Thermal Strain in Helical Slow-Wave Circuit on TWT Cold-Test Characteristics

✍ Scribed by Shengmei Yan; Lieming Yao; Zhonghai Yang

• Book ID: 114619493
• Publisher: IEEE
• Year: 2008
• Tongue: English
• Weight: 894 KB
• Volume: 55
• Category: Article
• ISSN: 0018-9383
• DOI: 10.1109/ted.2008.926725