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Effect of the deformation of the film -substrate system on the physicochemical properties of films and their adhesion strength

✍ Scribed by V. E. Basin; G. I. Artemova; T. N. Andreeva


Publisher
Springer US
Year
1975
Tongue
English
Weight
467 KB
Volume
9
Category
Article
ISSN
1573-8922

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A method to evaluate the substrate effect quantitatively in film indentation is proposed. For the thin film deposited on the substrate, the power function relationship is used to describe the loading curve of the film indentation behavior. The loading curve exponent of the power function which is th