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Effect of surface finish on the fracture behavior of Sn–Ag–Cu solder joints during high-strain rate loading

✍ Scribed by Taehoon You; Yunsung Kim; Woogwang Jung; Jeongtak Moon; Heeman Choe


Book ID
116605416
Publisher
Elsevier Science
Year
2009
Tongue
English
Weight
747 KB
Volume
486
Category
Article
ISSN
0925-8388

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