Effect of surface condition on boiling heat transfer from silicon chip with submicron-scale roughness

✍ Scribed by Jung-Yeul Jung; Ho-Young Kwak

• Book ID: 108141174
• Publisher: Elsevier Science
• Year: 2006
• Tongue: English
• Weight: 949 KB
• Volume: 49
• Category: Article
• ISSN: 0017-9310
• DOI: 10.1016/j.ijheatmasstransfer.2006.03.045