Effects of fin geometry on boiling heat transfer from silicon chips with micro-pin-fins immersed in FC-72

✍ Scribed by J.J. Wei; H. Honda

• Book ID: 108322905
• Publisher: Elsevier Science
• Year: 2003
• Tongue: English
• Weight: 685 KB
• Volume: 46
• Category: Article
• ISSN: 0017-9310
• DOI: 10.1016/s0017-9310(03)00226-6