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Effect of substrate surfaces and heat treatments on adhesion of Cu films

โœ Scribed by Guang J. Choi; Young S. Cho


Book ID
117358231
Publisher
Elsevier Science
Year
1997
Tongue
English
Weight
379 KB
Volume
32
Category
Article
ISSN
0167-577X

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Effects of Cu and Cu/Ti interlayer on ad
โœ Yangfeng Huang; Hanning Xiao; Zhibin Ma; Jianhua Wang; Pengzhao Gao ๐Ÿ“‚ Article ๐Ÿ“… 2007 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 784 KB

Diamond film were deposited on the cemented WC + 6% Co substrates by a microwave plasma chemical vapor deposition (CVD) system. The effects of Cu and Cu/Ti as interlayer on adhesion of diamond film were investigated. The surface morphology and composition of the film and microstructure of film/subst