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Effect of sputtering parameters on the adhesion force of copper/molybdenum metal on polymer substrate

✍ Scribed by Sang-Hyuk Lee; In-Sun Park; Bo-Hyun Seo; Jong Hyun Seo; Heehwan Choe; Jae-Hong Jeon; Yong Uk Lee; Munpyo Hong

No coin nor oath required. For personal study only.

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