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Effects of molybdenum, silver dopants and a titanium substrate layer on copper film metallization

โœ Scribed by Y. K. Ko; J. H. Jang; S. Lee; H. J. Yang; W. H. Lee; P. J. Reucroft; J. G. Lee

Book ID
110404999
Publisher
Springer
Year
2003
Tongue
English
Weight
274 KB
Volume
38
Category
Article
ISSN
0022-2461

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Effect of an interfacial layer on adhesi
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โœ Satoru Iwamori; Takehiro Miyashita; Shin Fukuda; Shouhei Nozaki; Kazufuyu Sudoh; ๐Ÿ“‚ Article ๐Ÿ“… 1998 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 243 KB

Copper (Cu) was sputtered onto a polyetheretherketon (PEEK) film and onto three types of polyimide (PI) films; pyromellitic dianhydride-oxydianiline (PMDA-ODA), biphenyl dianhydride-para-phenylene diamine (BPDA-PDA) and biphenyl dianhydride-oxydianiline (BPDA-ODA). All films were pre-treated with ox