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Effects of molybdenum, silver dopants and a titanium substrate layer on copper film metallization

โœ Scribed by Y. K. Ko; J. H. Jang; S. Lee; H. J. Yang; W. H. Lee; P. J. Reucroft; J. G. Lee


Book ID
110404999
Publisher
Springer
Year
2003
Tongue
English
Weight
274 KB
Volume
38
Category
Article
ISSN
0022-2461

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