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Effect of Sputtered Seed Layer on Electrodeposited NiFe/Cu Composite Wires

โœ Scribed by Li, X.P.; Yi, J.B.; Seet, H.L.; Yin, J.H.; Thongmee, S.; Ding, J.


Book ID
114652129
Publisher
IEEE
Year
2007
Tongue
English
Weight
522 KB
Volume
43
Category
Article
ISSN
0018-9464

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