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Effect of Solidification Texture on the Magnetostrictive Behavior of Galfenol

โœ Scribed by Emdadi, Ali Akbar; Nedjad, Syamak Hossein; Ghavifekr, Habib Badri


Book ID
121576022
Publisher
The Minerals, Metals & Materials Society
Year
2013
Tongue
English
Weight
638 KB
Volume
45
Category
Article
ISSN
1073-5623

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The electromigration performance of Al(1%Si)(0.04% Cu) and Al(1%Si)(0.5% Cu) alloys has been investigated. The addition of Cu from 0.04 to 0.5% significantly increased the mean time to failure (MTF) in the electromigration tests, as expected. When the Al(1%Si)(0.5% Cu) alloy is sputtered in contamin