Effect of silver content on thermal fatigue life of Sn-xAg-0.5Cu flip-chip interconnects

✍ Scribed by Shinichi Terashima; Yoshiharu Kariya; Takuya Hosoi; Masamoto Tanaka

• Book ID: 107453002
• Publisher: Springer US
• Year: 2003
• Tongue: English
• Weight: 206 KB
• Volume: 32
• Category: Article
• ISSN: 0361-5235
• DOI: 10.1007/s11664-003-0125-z