Effect of process parameters on the surface morphology and mechanical performance of silicon structures after deep reactive ion etching (DRIE)

✍ Scribed by Kuo-Shen Chen, ; Ayon, A.A.; Xin Zhang, ; Spearing, S.M.

• Book ID: 121817895
• Publisher: IEEE
• Year: 2002
• Tongue: English
• Weight: 442 KB
• Volume: 11
• Category: Article
• ISSN: 1057-7157
• DOI: 10.1109/JMEMS.2002.1007405