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Effect of organic additives on structure, resistivity, and room-temperature recrystallization of electrodeposited copper

✍ Scribed by V.A Vas'ko; I Tabakovic; S.C Riemer; M.T Kief

Book ID: 108207303
Publisher: Elsevier Science
Year: 2004
Tongue: English
Weight: 217 KB
Volume: 75
Category: Article
ISSN: 0167-9317
DOI: 10.1016/j.mee.2003.10.008

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